We are on the edge of electronic packaging turn key solutions for our clients. We have expertise on these Air Transport Rack enclosures' Termal Management (Convection Cooling , Fan Cooling , Liquid Cooling), 3D modelling, CAE Engineering especially FEA Engineering (Finite Elements Analysis) and CFD Enginering (Computational Fluid Dynamics) to manufacturing of Enclosures with required standarts.
ENDUS System is also kneading the fluid in its own dynamics. Also It offers guarantee of top pressure, maximum / minimum temperature, flow range limits. Our systems meet our clients' warranty conditions, quality expectations (ISO, EN, DIN, ASME, MIL-STD-810), certificate validation (CE, ATEX, Ex-proof) and delivery conditions standarts. Integrated embedded systems are also considered as an option in each new project that is ready PLC & On/Off Contact Systems as a control infrastructure.