Lets Define What We Potentially Do:
Electronic packaging is the technology of packaging electronic equipment
which helps and ease the interconnection of electronic components into printed wiring
boards (PWBs)and electronic
Today, electronic packaging has been applied in many sectors such as aerospace, military equipment, marine equipment, automotives, computers, telephones, entertainment
equipment consumer products, medical equipment. As new producction processes developed and the use of new materials increased, more compact packing systems needs to be developed. By the way the cost reduction and easy maintainability take place in new packing systems. This facilitates mass production for many projects. Morever
ergonomics and favorable appearance is increased. This leads to mass production of
products with aesthetic and ergonomic designs.
The efficiency of electronic packaging systems is shaped in the triangle of cost, design and reliability. At this point, packaging material is at the key position. In electronic systems, packaging enclosures are able to act as electrical conductors or insulators. Not only providing thermal paths ,but also protecting the circuits from environmental factors, such as Low Pressure (Altitude) High Temperature, Low Temperature, Temperature Shock, Contamination by Fluids, Solar Radiation (Sunshine), Rain, Humidity, Fungus, Salt Fog, Sand and Dust, Explosive Atmosphere, Immersion, Acceleration, Vibration, Shock, Pyroshock, Acidic Atmosphere, Gunfire Shock, Icing/Freezing Rain, Ballistic Shock, Vibro-Acoustic/Temperature, Freeze / Thaw, Rail Impact, Multi-Exciter.
Due to electronic packaging is a multi disciplinary design process including conceptual design, relevant analyses (FEA, CFD) , manufacturing, tests and field support, our team has been well qualified for multi-engineering skills from design state to final documentation. Performance requirements, Working environment, Manufacturability, Reliability, Cost are key considerations for a product meeting the performance requirements while it is working in a specified
environment with failure-free condition for a specified period of time.
Our Design Criteria with respect to Environmental Effects :
• Leakage factor of any fluids during operation
• User safety
• Storage safety or any waste materials disposals generated by the Electronic Packaging Unit.
• Moving equipment protection from incidental contact
• Reducing any emitted EMI/RFI to not harmful level
• Acceptance of any EMI/RFI received
• While in unpowered state, Ability to withstand foreseen shipping and storage conditions without any damage
• In operating environments conditions ideal operating working performance is excepted while powered, and not allow
damage to the operating parts of the unit especially ATR's
• Capacity to withstand "reasonable" misuse and keep on working
• Enclosure material must be resistant with all corrosive environmental conditions
• Capacity of shielding nature from contamination by the hardware.
Through the years, the design of electronic packaging is divided into some levels due
to the issues involved in the materials, configuration and space allocation. These
levels are respectively: Component , Module and Chasis levels. Module & Chassis Systems Electronic Packaging is our main scope in this business. These packagings connects the components and forming a environmental protecting system. Sometimes these systems can be seen as computers - or subsystem. Mainly card slides, card cages, clamps, spacers and fasteners has been used for Printed boards integrating in the chassis. When card slides increases heat dissipation, sometimes extra cooling needed with the help of extra fins, extra fans or cold plates. Our main focus are effective space management, reducing costs , and improving both mechanical and electro-mechanical reability.
The most important factor in these systems is reliability which we divided into two sections. One is electrical reliability influenced by temperature, current and voltage levels, corrosion , moisture, aging, solderability. Another is mechanical reability affected mainly vibration, shock and temperature again.
On the other hand, according to repeated military test results shown that main electromechanical failures result from thermal conditions. Vibration and shock comes second electromechanic malfunction. Broken wire leads, cracked solder joints, cracked ceramic packages, cracked silicone dies, broken connector pins such as module level and warped chassis, broken handles, broken card guides/cages, broken fasteners like spacers or screws seen as minor mechanical failures. Moreover, electromagnetic interference (EMI), electrostatic discharge (ESD) and noise induced failures are reported as minor electromechanical failures. Thats why we know that main design criteria is shaped around thermal management.
On the manufacturing side of these enclosures mainly two potential sources of failures:poor design and low tolerance manufacturing. Electronic packaging technology uses a variety of manufacturing techniques such as welding, electroplating, and injection molding to accomplish its purposes. Choosing the method of the manufacturing process is defined by the optimization of cost and manufacturing tolerances. However, at this stage, we believe that machining from solid material is the most robust method due to the very high safety coefficients. Although oversensitive manufacturing tolerances can improve the quality and reliability of a product, system costs and delivery time increasing. To ensure the reliability of the electronic packaging, higher safety factors must be defined and implemented on manufacturing quality processes as well as thermal and static analysis results shall be examined while prototype testing. On the other hand, some standards such as MIL-A-87244 has been developed for reducing failure risk of these packaging systems.
Environmental failures according to MIL-A-87244:
Fatigue Failures Due to Vibration, Shock, and Termal Cycling: Electrical Lead Wires, Solder Joints, Plated Through Holes, Component case
High Operating Temperatures
Aging Effects: Corrosion, Water Vapor, Embrittlement, Electrical drift